Intelligent Software

POWERFUL IMAGE PROCESSING ALGORITHMS AND ANALYSIS TOOLS

Description

Analyze BGA’s, QFN’s and related bottom terminated devices automatically to render detailed pass/fail reporting for complex multi-layered/double-sided board designs. Easily recall or import settings for the best image quality utilizing user created system setting templates stored to the library.

Detect, Analyze, Report

• Voiding (individual pocket percentage and cumulative percentage totals)
• BGA Sphere Circularity
• Pass/Fail Detection
• Bridging

(Optimum Pro Module Standard)

Image Processing Filters and Enhancement Tools

• Sharpen, Smooth, Edge Detect, Emboss, Background Subtract, Negative, 3D Gray Plot, Psuedo Color, Image Histogram
• Post Capture Image Enhancement Library
• Point to point Distance Measurement tool
• Image Annotation Tools
• Quad View

Semiconductor Measurement Tools (Pro Advanced Module)

• Bond Wire Sweep
• Die Attach Void Measurement
• Pass/Fail Analysis

Gull Wing, QFP, SOIC, Measurement tools (Pro Advanced Module)

• Joint Area Measurement
• Percent Void
• Pass/Fail Analysis

Drill Offset Measurement (Pro Advanced Module)

• Center to Center Offset (X,Y) Measurement.