PDR IR-E3

SIMPLE REWORK STATION FOR ALL BGA/SMT COMPONENTS

Description

The PDR IR-E3 is a high powered system, available with a multi-zone 2250W, 2800W or 3050W PCB preheater and is designed to rework SMD / BGA / uBGA / QFN / LEDs on small to medium-large PCB assemblies with upto a 18"/450mm PCB capacity. It is loaded with advanced features delivering many benefits including the highest performance and soldering quality available anywhere, yet it remains simple to set up and use.

The IR-E3 system is now available in 3 models - the E3S, E3G and E3M. Made in the United Kingdom with only the finest components for optimum precision, the PDR IR-E3 is our top selling system and one of the best performing BGA Rework Stations worldwide.

Applications

Desoldering, placement and soldering of all types of surface-mounted devices (SMD) BGA, QFN, LED, CSP, 0201, 01005

Features
  • Advanced Focused IR component heating
  • Quartz IR PCB preheating with up to 3 zones
  • Split Beam prism system for simultaneous PCB/component viewing
  • Precision Components Pick and Placement up to 10um
  • Precision PCB handling
  • Component Nest/Flux Application Facility
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control
  • Reflow Process Observation Camera
  • PCB Forced Air Cooling
Technical Data
  • Bench Area: 1400mm (w) x 600mm (d)
  • Weight: 65kg
  • Warranty: 2 years
  • Voltage Frequency: 208-240 volts 50/60Hz, up to 3KW
  • Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
  • PCB Preheater Power: 3050W Dark IR
  • PCB Preheater Heating Area Size: Up to 360x240mm
  • Number of PCB Preheater Zones: Up to 3 Zones
  • Spot Size Included: F700 (Ø 25-70mm), F200 (Ø 10-28mm)
  • Component Placement: Split Beam Prism Alignment
  • Placement Accuracy: Up to 10um
  • Component Temperature Sensing: Non-Contact IR Sensor
  • PCB Temperature Sensing: Non-Contact IR Sensor
  • Max PCB Size: 18”/450mm
  • Max Component Size: 55x55mm
  • Min Component Size: 01005
  • Number of TC Channels: 4
  • Operating Software: PDR’s Thermoactive Software Suite suitable for Windows 8 and Windows 10
Description

The PDR IR-E3 is a high powered system, available with a multi-zone 2250W, 2800W or 3050W PCB preheater and is designed to rework SMD / BGA / uBGA / QFN / LEDs on small to medium-large PCB assemblies with upto a 18"/450mm PCB capacity. It is loaded with advanced features delivering many benefits including the highest performance and soldering quality available anywhere, yet it remains simple to set up and use.

The IR-E3 system is now available in 3 models - the E3S, E3G and E3M. Made in the United Kingdom with only the finest components for optimum precision, the PDR IR-E3 is our top selling system and one of the best performing BGA Rework Stations worldwide.

Features
  • Advanced Focused IR component heating
  • Quartz IR PCB preheating with up to 3 zones
  • Split Beam prism system for simultaneous PCB/component viewing
  • Precision Components Pick and Placement up to 10um
  • Precision PCB handling
  • Component Nest/Flux Application Facility
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control
  • Reflow Process Observation Camera
  • PCB Forced Air Cooling
Technical Data
  • Bench Area: 1400mm (w) x 600mm (d)
  • Weight: 65kg
  • Warranty: 2 years
  • Voltage Frequency: 208-240 volts 50/60Hz, up to 3KW
  • Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
  • PCB Preheater Power: 3050W Dark IR
  • PCB Preheater Heating Area Size: Up to 360x240mm
  • Number of PCB Preheater Zones: Up to 3 Zones
  • Spot Size Included: F700 (Ø 25-70mm), F200 (Ø 10-28mm)
  • Component Placement: Split Beam Prism Alignment
  • Placement Accuracy: Up to 10um
  • Component Temperature Sensing: Non-Contact IR Sensor
  • PCB Temperature Sensing: Non-Contact IR Sensor
  • Max PCB Size: 18”/450mm
  • Max Component Size: 55x55mm
  • Min Component Size: 01005
  • Number of TC Channels: 4
  • Operating Software: PDR’s Thermoactive Software Suite suitable for Windows 8 and Windows 10
Applications

Desoldering, placement and soldering of all types of surface-mounted devices (SMD) BGA, QFN, LED, CSP, 0201, 01005