The IR-D3 Discovery rework system is tool
free, gas free, instantly/precisely controllable, clean, modular,
upgradeable and produces 100% yield SMD rework without any
complications. It provides the extremely high levels of profiling
and process control necessary for the effective rework of even the
most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips
and is ready for 0201 and lead-free applications.
The IR-D3 can be easily configured to your requirements, with a good
range of advanced features to choose from, allowing the operator to
quickly and safely rework all types of components without
overheating the component, adjacents or the PCB. It uses all the
proven attributes of PDR’s Focused IR technology, first introduced
in 1987 and now used worldwide by over 4500 customers.
Applications
Desoldering, placement and soldering of all types of surface mounted devices (SMD)
BGA, QFN, LED, CSP, 0201, 01005
Features
Advanced Focused IR component heating
Quartz IR PCB preheating with dual-zone
12”/300mm PCB Capacity
Split Beam prism system for simultaneous PCB/component viewing
Precision Components Pick and Placement up to 10um
Professional PCB handling
Component Nest/Flux Application Facility
Closed Loop Non-Contact Temperature Sensing
Advanced Automatic Thermal Process Control
Technical Data
Bench Area: 1400mm (w) x 600mm (d)
Weight: 65kg
Warranty: 2 years
Voltage Frequency: 208-240 volts 50/60Hz, up to 3KW
Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
PCB Preheater Power: 2250 Dark IR
PCB Preheater Heating Area Size: 240x240mm
Number of PCB Preheater Zones: 2 Zones
Spot Size Included: F700 (Ø 25-70mm)
Component Placement: Split Beam Prism Alignment
Placement Accuracy: Up to 10um
Component Temperature Sensing: Non-Contact IR Sensor
PCB Temperature Sensing: Contact Probe
Max PCB Size: 12”/300mm
Max Component Size: 55x55mm
Min Component Size: 01005
Number of TC Channels: 4
Operating Software: PDR’s Thermoactive Software Suite suitable for Windows 8 and Windows 10
Description
The IR-D3 Discovery rework system is tool
free, gas free, instantly/precisely controllable, clean, modular,
upgradeable and produces 100% yield SMD rework without any
complications. It provides the extremely high levels of profiling
and process control necessary for the effective rework of even the
most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips
and is ready for 0201 and lead-free applications.
The IR-D3 can be easily configured to your requirements, with a good
range of advanced features to choose from, allowing the operator to
quickly and safely rework all types of components without
overheating the component, adjacents or the PCB. It uses all the
proven attributes of PDR’s Focused IR technology, first introduced
in 1987 and now used worldwide by over 4500 customers.
Features
Advanced Focused IR component heating
Quartz IR PCB preheating with dual-zone
12”/300mm PCB Capacity
Split Beam prism system for simultaneous PCB/component viewing
Precision Components Pick and Placement up to 10um
Professional PCB handling
Component Nest/Flux Application Facility
Closed Loop Non-Contact Temperature Sensing
Advanced Automatic Thermal Process Control
Technical Data
Bench Area: 1400mm (w) x 600mm (d)
Weight: 65kg
Warranty: 2 years
Voltage Frequency: 208-240 volts 50/60Hz, up to 3KW
Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
PCB Preheater Power: 2250 Dark IR
PCB Preheater Heating Area Size: 240x240mm
Number of PCB Preheater Zones: 2 Zones
Spot Size Included: F700 (Ø 25-70mm)
Component Placement: Split Beam Prism Alignment
Placement Accuracy: Up to 10um
Component Temperature Sensing: Non-Contact IR Sensor
PCB Temperature Sensing: Contact Probe
Max PCB Size: 12”/300mm
Max Component Size: 55x55mm
Min Component Size: 01005
Number of TC Channels: 4
Operating Software: PDR’s Thermoactive Software Suite suitable for Windows 8 and Windows 10
Applications
Desoldering, placement and soldering of all types of surface mounted devices (SMD)
BGA, QFN, LED, CSP, 0201, 01005
