Ideal for desoldering small THT components and SMD pad cleaning.
It provides all the advantages of the JBC Most Efficient Soldering System in the smallest footprint:
Ideal for desoldering small THT components and SMD pad cleaning.
It provides all the advantages of the JBC Most Efficient Soldering System in the smallest footprint:
Specification | |
Peak power | 40W - 23.5V |
Selectable temperature | 90 to 450ºC / 190 to 840ºF |
Vacuum | 75% / 570 mmHg / 22.4 inHg |
Flow rate | 9 SLPM |
Temperature accuracy | ±3% |
ESD safe | Meet ANSI/ESD S20.20-2021 |
Equipotential bonding | Connection to EPA |
Tip-to-ground resistance | <2 ohms |
Tip-to-ground voltage | <20 mV RMS |
USB-B | PC communications |
FAE / Robot connector | Remote control or FAE Fume Extractor connection |
Weight and Dimensions | |
Control Unit | 170 x 176 x 145 mm / 4.00 kg. 6.69 x 6.93 x 5.71 in / 8.82 lb. |
Package | 495 x 295 x 255 mm / 5.90 kg. 19.49 x 11.61 x 10.04 in / 13.01 lb. |
Specification | |
Peak power | 40W - 23.5V |
Selectable temperature | 90 to 450ºC / 190 to 840ºF |
Vacuum | 75% / 570 mmHg / 22.4 inHg |
Flow rate | 9 SLPM |
Temperature accuracy | ±3% |
ESD safe | Meet ANSI/ESD S20.20-2021 |
Equipotential bonding | Connection to EPA |
Tip-to-ground resistance | <2 ohms |
Tip-to-ground voltage | <20 mV RMS |
USB-B | PC communications |
FAE / Robot connector | Remote control or FAE Fume Extractor connection |
Weight and Dimensions | |
Control Unit | 170 x 176 x 145 mm / 4.00 kg. 6.69 x 6.93 x 5.71 in / 8.82 lb. |
Package | 495 x 295 x 255 mm / 5.90 kg. 19.49 x 11.61 x 10.04 in / 13.01 lb. |