BGA/SMT REWORK STATION FOR XL PCBS
The PDR IR-E6 SMD/BGA rework station, using
PDR’s patented Focused IR technology, has been specifically designed
to cope with the challenges of repairing today’s PCB assemblies.
The system is tool free, gas free, instantly/precisely controllable,
clean, modular, upgradeable and produces 100% yield BGA rework
without any complications. It provides the extremely high levels of
profiling and process control necessary for the effective rework of
even the most advanced packages, including SMDs, BGAs, CSPs, QFNs,
Flipchips and is ready for 0201 and lead-free applications.
The IR-E6 is well specified yet can be easily configured to your
exact requirements, with a good range of advanced features to choose
from, allowing the operator to quickly and safely rework all types
of components without overheating the component, adjacents or the
PCB. It uses all the proven attributes of PDR’s Focused IR
technology, first introduced in 1987 and now used worldwide by over
4500 customers.
Desoldering, placement and soldering of all types of surface-mounted devices (SMD) BGA, QFN, LED, CSP, 0201, 01005
The PDR IR-E6 SMD/BGA rework station, using
PDR’s patented Focused IR technology, has been specifically designed
to cope with the challenges of repairing today’s PCB assemblies.
The system is tool free, gas free, instantly/precisely controllable,
clean, modular, upgradeable and produces 100% yield BGA rework
without any complications. It provides the extremely high levels of
profiling and process control necessary for the effective rework of
even the most advanced packages, including SMDs, BGAs, CSPs, QFNs,
Flipchips and is ready for 0201 and lead-free applications.
The IR-E6 is well specified yet can be easily configured to your
exact requirements, with a good range of advanced features to choose
from, allowing the operator to quickly and safely rework all types
of components without overheating the component, adjacents or the
PCB. It uses all the proven attributes of PDR’s Focused IR
technology, first introduced in 1987 and now used worldwide by over
4500 customers.
Desoldering, placement and soldering of all types of surface-mounted devices (SMD) BGA, QFN, LED, CSP, 0201, 01005