PDR IR-E6

BGA/SMT REWORK STATION FOR XL PCBS

Description

The PDR IR-E6 SMD/BGA rework station, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.

The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.

The IR-E6 is well specified yet can be easily configured to your exact requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4500 customers.

Applications

Desoldering, placement and soldering of all types of surface-mounted devices (SMD) BGA, QFN, LED, CSP, 0201, 01005

Features
  • Gantry Mounted Advanced Focused IR component heating
  • Large Quartz IR PCB preheating with 3 zones
  • 24”/620mm PCB Capacity
  • Split Beam prism system for simultaneous PCB/component viewing
  • Precision Components Pick and Placement up to 10um
  • Precision PCB handling
  • Component Nest/Flux Application Facility
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control
  • Reflow Process Observation Camera
  • PCB Forced Air Cooling
Technical Data
  • Bench Area: 2000mm (w) x 1000mm (d)
  • Weight: 100kg
  • Warranty: 2 years
  • Voltage Frequency: 208-240 volts 50/60Hz, up to 3KW
  • Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
  • PCB Preheater Power: 3200W Dark IR
  • PCB Preheater Heating Area Size: 500x240mm
  • Number of PCB Preheater Zones: 3 Zones
  • Spot Size Included: F700 (Ø 25-70mm), F200 (Ø10-28mm)
  • Component Placement: Split Beam Prism Alignment
  • Placement Accuracy: Up to 10um
  • Component Temperature Sensing: Non-Contact IR Sensor
  • PCB Temperature Sensing: Non-Contact IR Sensor
  • Max PCB Size: 24”/620mm
  • Max Component Size: 55x55mm
  • Min Component Size: 01005
  • Number of TC Channels: 4
  • Operating Software: PDR’s Thermoactive Software Suite suitable for Windows 8 and Windows 10
Description

The PDR IR-E6 SMD/BGA rework station, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.

The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.

The IR-E6 is well specified yet can be easily configured to your exact requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4500 customers.

Features
  • Gantry Mounted Advanced Focused IR component heating
  • Large Quartz IR PCB preheating with 3 zones
  • 24”/620mm PCB Capacity
  • Split Beam prism system for simultaneous PCB/component viewing
  • Precision Components Pick and Placement up to 10um
  • Precision PCB handling
  • Component Nest/Flux Application Facility
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control
  • Reflow Process Observation Camera
  • PCB Forced Air Cooling
Technical Data
  • Bench Area: 2000mm (w) x 1000mm (d)
  • Weight: 100kg
  • Warranty: 2 years
  • Voltage Frequency: 208-240 volts 50/60Hz, up to 3KW
  • Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
  • PCB Preheater Power: 3200W Dark IR
  • PCB Preheater Heating Area Size: 500x240mm
  • Number of PCB Preheater Zones: 3 Zones
  • Spot Size Included: F700 (Ø 25-70mm), F200 (Ø10-28mm)
  • Component Placement: Split Beam Prism Alignment
  • Placement Accuracy: Up to 10um
  • Component Temperature Sensing: Non-Contact IR Sensor
  • PCB Temperature Sensing: Non-Contact IR Sensor
  • Max PCB Size: 24”/620mm
  • Max Component Size: 55x55mm
  • Min Component Size: 01005
  • Number of TC Channels: 4
  • Operating Software: PDR’s Thermoactive Software Suite suitable for Windows 8 and Windows 10
Applications

Desoldering, placement and soldering of all types of surface-mounted devices (SMD) BGA, QFN, LED, CSP, 0201, 01005