PDR IR-E1

ENTRY-LEVEL SMD/BGA REWORK STATION

Description

Today there is a need for lower cost and upgradeable equipment without a loss in soldering quality. The PDR IR-C3 Chipmate SMT/BGA rework station, using PDR’s patented Focused IR technology, have been specifically engineered to meet this challenge.

The IR-C3 Chipmate comes with a good range of standard features allowing the operator to quickly, safely rework all types of components.

The station is tool free, gas free, instantly/precisely controllable, clean, modular and produces 100% yield BGA rework without any complications. The IR-C3 uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4500 customers.

Model shown - C3 with an additional Non-Contact Sensor

Applications

Desoldering, placement and soldering of all types of surface mounted devices (SMD) BGA, QFN, LED, CSP, 0201, 01005

Features
  • Advanced Focused IR component heating
  • Quartz IR PCB preheating
  • Bench Mounted Workholder
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control
  • Handheld Suction Wand
Technical Data
  • Bench Area: 1200mm (w) x 600mm (d)
  • Weight: 45kg
  • Warranty: 2 years
  • Voltage Frequency: 208-240 volts 50/60Hz
  • Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
  • PCB Preheater Power: 2250W Dark IR
  • PCB Preheater Heating Area Size: 240x240mm
  • Number of PCB Preheater Zones: 1
  • Spot Size Included: F700 (Ø 25-70mm)
  • Component Temperature Sensing: Non-Contact IR Sensor
  • PCB Temperature Sensing: Contact Probe
  • Max PCB Size: 12”/300mm
  • Max Component Size: 55x55mm
  • Min Component Size: 01005
  • Number of TC Channels: 4
  • Operating Software: PDR’s Thermoactive Software Suite suitable for Windows 8 and Windows 10
Description

Today there is a need for lower cost and upgradeable equipment without a loss in soldering quality. The PDR IR-C3 Chipmate SMT/BGA rework station, using PDR’s patented Focused IR technology, have been specifically engineered to meet this challenge.

The IR-C3 Chipmate comes with a good range of standard features allowing the operator to quickly, safely rework all types of components.

The station is tool free, gas free, instantly/precisely controllable, clean, modular and produces 100% yield BGA rework without any complications. The IR-C3 uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4500 customers.

Model shown - C3 with an additional Non-Contact Sensor

Features
  • Advanced Focused IR component heating
  • Quartz IR PCB preheating
  • Bench Mounted Workholder
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control
  • Handheld Suction Wand
Technical Data
  • Bench Area: 1200mm (w) x 600mm (d)
  • Weight: 45kg
  • Warranty: 2 years
  • Voltage Frequency: 208-240 volts 50/60Hz
  • Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
  • PCB Preheater Power: 2250W Dark IR
  • PCB Preheater Heating Area Size: 240x240mm
  • Number of PCB Preheater Zones: 1
  • Spot Size Included: F700 (Ø 25-70mm)
  • Component Temperature Sensing: Non-Contact IR Sensor
  • PCB Temperature Sensing: Contact Probe
  • Max PCB Size: 12”/300mm
  • Max Component Size: 55x55mm
  • Min Component Size: 01005
  • Number of TC Channels: 4
  • Operating Software: PDR’s Thermoactive Software Suite suitable for Windows 8 and Windows 10
Applications

Desoldering, placement and soldering of all types of surface mounted devices (SMD) BGA, QFN, LED, CSP, 0201, 01005